教育经历
- 1998-09 ~ 2002-07 江苏科技大学 材料科学与工程 学士
- 2002-09 ~ 2005-02 江苏科技大学 材料科学与工程 硕士
- 2005-02 ~ 2009-03 网投十大信誉排名品牌 材料科学与工程 博士
工作经历
- 2009-04 ~ 2018-12 网投十大信誉排名品牌 助理研究员
- 2019-01 ~ 至今 网投十大信誉排名品牌 副研究员
研究方向
- 焊接界面及可靠性
- 焊接过程数值模拟
研究情况
通过设计加速试验和多尺度/多物理场模拟计算方法相结合，开展了微互连界面可靠性相关热点问题（电迁移、Kirkendall空洞）、异种材料焊接方法及界面微缺陷问题等研究。
荣誉信息
- 上海市优秀博士论文
- 网投十大信誉排名品牌“SMC-晨星青年学者奖励计划”（B）类
- 网投十大信誉排名品牌优秀共产党员
- 网投十大信誉排名品牌优秀班主任
论文信息
- Qingzhao Wang, Maolong Zhang, Weihua Liu, Xiao Wei, Jijin Xu, Junmei Chen, Hao Lu*, Chun Yu*. Cr or C controlled formation of transition martensite in dissimilar metal weld. Materials Characterization 147 (2019) 434–442.
- Jijin Xu, Jingyao Chen, Chun Yu*, Yi Duan, Junmei Chen, Hao Lu*. Comparison of residual stress induced by TIG and LBW in girth weld of AISI 304 stainless steel pipes. Journal of Materials Processing Tech. 248(2017) 178-184.
- Qingzhao Wang, Maolong Zhang, Weihua Liu, Xiao Wei, Jijin Xu, Junmei Chen, Hao Lu*, Chun Yu*. Study of type-II boundary behavior during SA508-3EQ309L overlay weld interfacial failure process. Journal of Materials Processing Tech. 247(2017) 64-72.
- Dezhi Yang, Chen Hua, Shengzhi Qu, Jijin Xu, Junmei Chen, Chun Yu*, Hao Lu*. Isothermal transformation of γ-Co to ε-Co in Stellite 6 coatings. Metallurgical and Materials Transactions A 50A (2019) 1153-1161.
- Chen Hua, Hao Lu*, Chun Yu*, Junmei Chen, Maolong Zhang, Dayong Li. Reduction of Laves phase in nickel alloy welding process under ultrasonic ampere force. Journal of Materials Processing Tech 252(2018)389-397.
- Chen Hua, Hao Lu, Chun Yu*, Jun-Mei Chen, Xiao Wei, Ji-jin Xu. Reduction of ductility-dip cracking susceptibility by ultrasonic-assisted GTAW. Journal of Materials Processing Technology 239 (2017) 240-250.
- Jie-Shi Chen, Cheng-Hui Ye, Chun Yu*, Hao Lu*. The micro-mechanism for the effect of Sn grain orientation on substrate consumption in Sn solder joints. Computational Materials Science 108(2015) 1-7.
- Chun Yu, Yang Yang, Jieshi Chen, Jijin Xu, Junmei Chen, Hao Lu*. Effect of deposit thickness during electroplating on Kirkendall voiding at Sn/Cu joints. Materials Letters 128(2014) 9-11.
- Chun Yu，Jieshi Chen，Zhewen Cheng，Yuqian Huang，Junmei Chen，Jijin Xu*，Hao Lu*，Fine grained Cu film promoting kirkendall voiding at Cu3Sn/Cu interface，Journal of Alloys and Compounds 660 (2016) 80-84.
- Xiao Wei, Mengjia Xu, Qingzhao Wang, Maolong Zhang, Weihua Liu, Jijin Xu, Junmei Chen, Hao Lu*, Chun Yu*. Effect of local texture and precipitation on the ductility dip cracking of ERNiCrFe-7A Ni-based overlay. Materials and Design 110 (2016) 90-98.
- Chun Yu, Dongye Wang, Jieshi Chen, Jijin Xu, Junmei Chen, Hao Lu*. Study of Cu6Sn5 and Cu3Sn growth behaviors by considering Trace Zn. Materials Letters 121(2014) 166-169.
- Jie Shi Chen, Cheng Hui Ye, Jun Mei Chen, Ji Jin Xu, Chun Yu*, Hao Lu*. Sn whiskers mitigation by refining grains of Cu substrate during the room temperature exposure. Materials Letters 161 (2015) 201-204.
- Chun Yu, Jieshi Chen, Kai-yun Wang, Jingqing Chen, Hao Lu*. Suppression effect of Cu and Ag on Cu3Sn layer in solder joints. Journal of Materials Science: Materials in Electronics 24(2013) 4630-4635